• DocumentCode
    2410988
  • Title

    A method to reuse fiber-reinforced waste from e-waste as filler for polymeric composite

  • Author

    Duan, Huabo ; Jia, Weifeng ; Li, Jinhui

  • fYear
    2009
  • fDate
    18-20 May 2009
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    TREPREG materials (PM) which are reclaimed from waste printed circuit boards industry was used to produce polymeric composites by an extrusion and injection process through adding polypropylene (PP) as a bonding agent. The results show that the increments of tensile strength, tensile modulus, flexural strength and flexural modulus of the PP composites are greatly achieved than unfilled PP. The maximum content of waste PM in polymeric composites was 30 wt%, of which the strength of tensile, flexural and impact properties could reach to 25.43 MPa, 48.30 MPa and 11.81 J/m respectively. This technique provided a promising method to reuse fiber-reinforced polymeric and expanded to composite plastic waste.
  • Keywords
    bending strength; elastic moduli; electronic products; extrusion; fibre reinforced plastics; injection moulding; printed circuits; recycling; tensile strength; waste disposal; PP composites; TREPREG materials; bonding agent; composite plastic waste; e-waste; extrusion process; filler; flexural modulus; flexural strength; injection process; polymeric composite; polypropylene; reuse fiber-reinforced polymeric; reuse fiber-reinforced waste; tensile modulus; tensile strength; waste printed circuit boards industry; Composite materials; Electronic waste; Manufacturing; Materials science and technology; Mechanical factors; Plastics; Polymers; Printed circuits; Recycling; Transmission line matrix methods;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sustainable Systems and Technology, 2009. ISSST '09. IEEE International Symposium on
  • Conference_Location
    Phoenix, AZ
  • Print_ISBN
    978-1-4244-4324-6
  • Type

    conf

  • DOI
    10.1109/ISSST.2009.5156715
  • Filename
    5156715