Title :
A method to reuse fiber-reinforced waste from e-waste as filler for polymeric composite
Author :
Duan, Huabo ; Jia, Weifeng ; Li, Jinhui
Abstract :
TREPREG materials (PM) which are reclaimed from waste printed circuit boards industry was used to produce polymeric composites by an extrusion and injection process through adding polypropylene (PP) as a bonding agent. The results show that the increments of tensile strength, tensile modulus, flexural strength and flexural modulus of the PP composites are greatly achieved than unfilled PP. The maximum content of waste PM in polymeric composites was 30 wt%, of which the strength of tensile, flexural and impact properties could reach to 25.43 MPa, 48.30 MPa and 11.81 J/m respectively. This technique provided a promising method to reuse fiber-reinforced polymeric and expanded to composite plastic waste.
Keywords :
bending strength; elastic moduli; electronic products; extrusion; fibre reinforced plastics; injection moulding; printed circuits; recycling; tensile strength; waste disposal; PP composites; TREPREG materials; bonding agent; composite plastic waste; e-waste; extrusion process; filler; flexural modulus; flexural strength; injection process; polymeric composite; polypropylene; reuse fiber-reinforced polymeric; reuse fiber-reinforced waste; tensile modulus; tensile strength; waste printed circuit boards industry; Composite materials; Electronic waste; Manufacturing; Materials science and technology; Mechanical factors; Plastics; Polymers; Printed circuits; Recycling; Transmission line matrix methods;
Conference_Titel :
Sustainable Systems and Technology, 2009. ISSST '09. IEEE International Symposium on
Conference_Location :
Phoenix, AZ
Print_ISBN :
978-1-4244-4324-6
DOI :
10.1109/ISSST.2009.5156715