DocumentCode :
2411336
Title :
Sustainability analysis of atomic layer deposition for microelectronics manufacturing
Author :
Yuan, Chris Y. ; Dornfeld, David
Author_Institution :
Dept. of Mech. Eng., Univ. of California, Berkeley, CA, USA
fYear :
2009
fDate :
18-20 May 2009
Firstpage :
1
Lastpage :
1
Abstract :
As the miniaturization trend continues in the semiconductor manufacturing industry, atomic layer deposition has received much attention in recent years due to its ability to obtain atomic layer control of film growth. The present paper analyses the sustainability of the atomic layer deposition processes, focusing on materials flow analysis and energy flow analysis.
Keywords :
atomic layer deposition; chemical reactions; integrated circuit manufacture; semiconductor device manufacture; sustainable development; atomic layer deposition; chemical reactants; film growth; microelectronics manufacturing; semiconductor manufacturing industry; sustainability analysis; Aluminum oxide; Atomic layer deposition; Chemical vapor deposition; Conducting materials; Inductors; Manufacturing; Microelectronics; Rough surfaces; Semiconductor films; Surface roughness;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Sustainable Systems and Technology, 2009. ISSST '09. IEEE International Symposium on
Conference_Location :
Phoenix, AZ
Print_ISBN :
978-1-4244-4324-6
Type :
conf
DOI :
10.1109/ISSST.2009.5156732
Filename :
5156732
Link To Document :
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