DocumentCode
2411336
Title
Sustainability analysis of atomic layer deposition for microelectronics manufacturing
Author
Yuan, Chris Y. ; Dornfeld, David
Author_Institution
Dept. of Mech. Eng., Univ. of California, Berkeley, CA, USA
fYear
2009
fDate
18-20 May 2009
Firstpage
1
Lastpage
1
Abstract
As the miniaturization trend continues in the semiconductor manufacturing industry, atomic layer deposition has received much attention in recent years due to its ability to obtain atomic layer control of film growth. The present paper analyses the sustainability of the atomic layer deposition processes, focusing on materials flow analysis and energy flow analysis.
Keywords
atomic layer deposition; chemical reactions; integrated circuit manufacture; semiconductor device manufacture; sustainable development; atomic layer deposition; chemical reactants; film growth; microelectronics manufacturing; semiconductor manufacturing industry; sustainability analysis; Aluminum oxide; Atomic layer deposition; Chemical vapor deposition; Conducting materials; Inductors; Manufacturing; Microelectronics; Rough surfaces; Semiconductor films; Surface roughness;
fLanguage
English
Publisher
ieee
Conference_Titel
Sustainable Systems and Technology, 2009. ISSST '09. IEEE International Symposium on
Conference_Location
Phoenix, AZ
Print_ISBN
978-1-4244-4324-6
Type
conf
DOI
10.1109/ISSST.2009.5156732
Filename
5156732
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