Abstract :
The following topics are dealt with: bias temperature instability; soft errors; fabless & foundry interaction; back-end-of-line interconnects and; memory circuits.
Keywords :
foundries; integrated circuit interconnections; integrated circuit reliability; integrated memory circuits; back-end-of-line interconnects; bias temperature instability; fabless foundry interaction; memory circuits; soft errors;
Conference_Titel :
Integrated Reliability Workshop Final Report (IRW), 2010 IEEE International
Conference_Location :
Fallen Leaf, CA
Print_ISBN :
978-1-4244-8521-5
DOI :
10.1109/IIRW.2010.5706468
