DocumentCode :
2411413
Title :
Development of a skin for intuitive interaction with an assistive robot
Author :
Markham, Heather C. ; Brewer, Bambi R.
Author_Institution :
Dept. of Rehabilitation Sci. & Technol., Univ. of Pittsburgh, Pittsburgh, PA, USA
fYear :
2009
fDate :
3-6 Sept. 2009
Firstpage :
5969
Lastpage :
5972
Abstract :
Assistive robots for persons with physical limitations need to interact with humans in a manner that is safe to the user and the environment. Early work in this field centered on task specific robots. Recent work has focused on the use of the MANUS ARM and the development of different interfaces. The most intuitive interaction with an object is through touch. By creating a skin for the robot arm which will directly control its movement compliance, we have developed a novel and intuitive method of interaction. This paper describes the development of a skin which acts as a switch. When activated through touch, the skin will put the arm into compliant mode allowing it to be moved to the desired location safely, and when released will put the robot into non-compliant mode thereby keeping it in place. We investigated four conductive materials and four insulators, selecting the best combination based on our design goals of the need for a continuous activation surface, the least amount of force required for skin activation, and the most consistent voltage change between the conductive surfaces measured during activation.
Keywords :
conducting materials; handicapped aids; insulators; medical robotics; skin; assistive robot; conductive materials; conductive surfaces; continuous activation surface; insulator; noncompliant mode; robot arm; skin activation; Biomimetic Materials; Electric Conductivity; Equipment Design; Equipment Failure Analysis; Robotics; Signal Processing, Computer-Assisted; Skin, Artificial; Stress, Mechanical; Touch; Transducers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society, 2009. EMBC 2009. Annual International Conference of the IEEE
Conference_Location :
Minneapolis, MN
ISSN :
1557-170X
Print_ISBN :
978-1-4244-3296-7
Electronic_ISBN :
1557-170X
Type :
conf
DOI :
10.1109/IEMBS.2009.5334522
Filename :
5334522
Link To Document :
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