DocumentCode
2411810
Title
Hot carrier impact on the small signal equivalent circuit
Author
Negre, L. ; Roy, D. ; Boret, S. ; Scheer, P. ; Kauffmann, N. ; Gloria, D. ; Ghibaudo, G.
Author_Institution
IMEP-LAHC, Grenoble, France
fYear
2010
fDate
17-21 Oct. 2010
Firstpage
72
Lastpage
75
Abstract
RF reliability is becoming an increasing concern for actual technology platforms. In this context, small signal equivalent circuit degradation under hot carrier stress is investigated. It is shown that some lumped elements such as the conductance, the transconductance, the gate-to-drain capacitance, and series resistances are degraded. The application of corrections based on physical phenomenon explains the major part of the hot carrier impact on the small signal equivalent circuit. Furthermore, the overlap gate-to-drain capacitance degradation is emphasized.
Keywords
capacitance; equivalent circuits; radiofrequency integrated circuits; RF reliability; gate-to-drain capacitance; hot carrier stress; lumped elements; series resistances; signal equivalent circuit degradation; small signal equivalent circuit; Degradation; Equivalent circuits; Hot carriers; MOSFET circuits; Radio frequency; Stress; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report (IRW), 2010 IEEE International
Conference_Location
Stanford Sierra, CA
ISSN
1930-8841
Print_ISBN
978-1-4244-8521-5
Type
conf
DOI
10.1109/IIRW.2010.5706489
Filename
5706489
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