DocumentCode
2412312
Title
Improved evaluation of DRAM transistors and accurate resistance measurement for real chip contacts by nano-probing technique
Author
Park, Hyunho ; Chae, Kyosuk ; Yamada, Satoru ; Kuh, Hyung-Suk ; Choi, Byoungdeok
Author_Institution
Semicond. R&D Center, Samsung Electron. Co., Hwasung, South Korea
fYear
2010
fDate
17-21 Oct. 2010
Firstpage
161
Lastpage
163
Abstract
In this study we have measured and analyzed characteristics of real transistors on dynamic random access memories (DRAM) including cell transistor by using nano-probing system for improved failure analysis. Measuring results of the conventional pad probing and nano-probing were compared on test element group (TEG) patterns of large transistors. The transistor characteristics of nano-probing results were evaluated for the each layer of DRAM structure with comparing the TEGs pad probing results. We also have measured sheet resistance (Rs) and contact resistance (Rc) on source and drain of real transistor bit line contacts (BLC) by nano-probing with transmission line model (TLM) method. We could find the effect of floating BLC was negligible and the effective resistance was only depending on the facing length of the contact plug bottom.
Keywords
DRAM chips; electric resistance measurement; DRAM transistors; bit line contacts; contact resistance; nano probing; nanoprobing technique; real chip contacts; resistance measurement; sheet resistance; test element group; Electrical resistance measurement; Failure analysis; Random access memory; Resistance; Semiconductor device measurement; Transistors; Transmission line measurements;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report (IRW), 2010 IEEE International
Conference_Location
Stanford Sierra, CA
ISSN
1930-8841
Print_ISBN
978-1-4244-8521-5
Type
conf
DOI
10.1109/IIRW.2010.5706514
Filename
5706514
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