DocumentCode :
2413144
Title :
An efficient thermal stress estimation methodology
Author :
Tai, Ming-Lang ; Chen, Wei-Jen
Author_Institution :
NB Bus. Unit, Chunghwa Picture Tubes, Ltd., Padeh, Taiwan
fYear :
2009
fDate :
25-28 May 2009
Firstpage :
709
Lastpage :
713
Abstract :
We had proposed fast thermal stress estimation methodology for the components on system board when the system is stationary within specific ambient air temperature. Now, we will propose one efficient thermal stress estimation methodology for the electronic system board with cover enclosed within specific ambient air temperature. We had gotten good results as the total estimation error is 2degC with 90% confidence level by means of block adaptation methodology.
Keywords :
thermal management (packaging); thermal stresses; ambient air temperature; block adaptation methodology; electronic system board; thermal stress estimation; Adaptive filters; Cities and towns; Consumer electronics; Electron tubes; Estimation error; Filtering algorithms; Niobium; Stress measurement; Temperature; Thermal stresses; CFD; FPD; Fusion; adaptive filtering; thermal stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Consumer Electronics, 2009. ISCE '09. IEEE 13th International Symposium on
Conference_Location :
Kyoto
Print_ISBN :
978-1-4244-2975-2
Electronic_ISBN :
978-1-4244-2976-9
Type :
conf
DOI :
10.1109/ISCE.2009.5156834
Filename :
5156834
Link To Document :
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