DocumentCode
2413144
Title
An efficient thermal stress estimation methodology
Author
Tai, Ming-Lang ; Chen, Wei-Jen
Author_Institution
NB Bus. Unit, Chunghwa Picture Tubes, Ltd., Padeh, Taiwan
fYear
2009
fDate
25-28 May 2009
Firstpage
709
Lastpage
713
Abstract
We had proposed fast thermal stress estimation methodology for the components on system board when the system is stationary within specific ambient air temperature. Now, we will propose one efficient thermal stress estimation methodology for the electronic system board with cover enclosed within specific ambient air temperature. We had gotten good results as the total estimation error is 2degC with 90% confidence level by means of block adaptation methodology.
Keywords
thermal management (packaging); thermal stresses; ambient air temperature; block adaptation methodology; electronic system board; thermal stress estimation; Adaptive filters; Cities and towns; Consumer electronics; Electron tubes; Estimation error; Filtering algorithms; Niobium; Stress measurement; Temperature; Thermal stresses; CFD; FPD; Fusion; adaptive filtering; thermal stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Consumer Electronics, 2009. ISCE '09. IEEE 13th International Symposium on
Conference_Location
Kyoto
Print_ISBN
978-1-4244-2975-2
Electronic_ISBN
978-1-4244-2976-9
Type
conf
DOI
10.1109/ISCE.2009.5156834
Filename
5156834
Link To Document