Title :
Failure mechanisms in semiconductor memory circuits
Author :
Haythornthwaite, Ray
Author_Institution :
Chipworks Inc., Ottawa, Ont., Canada
Abstract :
This tutorial will describe the physical failure mechanisms that commonly occur in memory and other microcircuits. There will be a general introduction to reliability concepts and definitions. The tutorial will follow a physics of failure approach, emphasizing cause and cure, rather than a statistical reliability. Many of the failure mechanisms affecting memories are general to other microcircuits as well. The failure mechanisms will be split into three areas. Failures of the assembly and packaging, failures of the interconnects and the remainder of the die, and failures of the transistors
Keywords :
failure analysis; integrated memory circuits; reliability; assembly; failure mechanisms; interconnects; packaging; physics of failure; reliability; semiconductor memory circuits; Chemical processes; Circuits; Equations; Failure analysis; Manufacturing; Physics; Semiconductor memory; Silicon; Stress; Temperature;
Conference_Titel :
Memory Technology, Design and Testing, 2000. Records of the 2000 IEEE International Workshop on
Conference_Location :
San Jose, CA
Print_ISBN :
0-7695-0689-5
DOI :
10.1109/MTDT.2000.868609