A scaled floating body cell (FBC) memory with high-k+metal gate on thin-silicon and thin-BOX for 16-nm technology node and beyond

A scaled, undoped, thin-BOX, planar FBC technology is demonstrated for the first time, featuring 10-nm BOX, 25-nm SOI, high-k, metal gate, separate back-gate (BG) doping, and raised source-drain epitaxy. Retention of a minimum 3-muA sensing window for 100 ms, in devices with 60-nm gate-length (L_g) and 70-nm diffusion width (W), represents the best retention time of all sub-100-nm FBC devices. FBC scaling is predicted to be feasible at least to 40-nm L_g, enabling memory cell sizes much smaller than 6T-SRAM at 16-nm technology node. Functional 32-nm L_g devices suggest the feasibility at the 11-nm technology node.