Title :
On the dynamic resistance and reliability of phase change memory
Author :
Rajendran, B. ; Lee, M.H. ; Breitwisch, M. ; Burr, G.W. ; Shih, Y.H. ; Cheek, R. ; Schrott, A. ; Chen, C.F. ; Lamorey, M. ; Joseph, E. ; Zhu, Y. ; Dasaka, R. ; Flaitz, P.L. ; Baumann, F.H. ; Lung, H.L. ; Lam, C.
Author_Institution :
IBM T.J. Watson Res. Center, Yorktown Heights, NY
Abstract :
A novel characterization metric for phase change memory based on the measured cell resistance during RESET programming is introduced. We show that this dasiadynamic resistancepsila (Rd) is inversely related to the programming current (I), as Rd = [A/I] + B. While the slope parameter A depends only on the intrinsic properties of the phase change material, the intercept B also depends on the effective physical dimensions of the memory element. We demonstrate that these two parameters provide characterization and insight into the degradation mechanisms of memory cells during operation.
Keywords :
electric resistance measurement; phase change materials; random-access storage; semiconductor device reliability; RESET programming; cell resistance; degradation mechanisms; dynamic resistance; intrinsic properties; memory cells; phase change memory; reliability; CMOS technology; Conductivity; Current measurement; Degradation; Dynamic programming; Electrical resistance measurement; Materials reliability; Phase change materials; Phase change memory; Phase change random access memory; NV memory and chalcogenide; PCRAM;
Conference_Titel :
VLSI Technology, 2008 Symposium on
Conference_Location :
Honolulu, HI
Print_ISBN :
978-1-4244-1802-2
Electronic_ISBN :
978-1-4244-1803-9
DOI :
10.1109/VLSIT.2008.4588576