• DocumentCode
    2414459
  • Title

    Understanding and prediction of EWF modulation induced by various dopants in the gate stack for a gate-first integration scheme

  • Author

    Wang, X.P. ; Yu, H.Y. ; Yeo, Y.C. ; Li, M.-F. ; Chang, S.-Z. ; Cho, H-J. ; Kubicek, S. ; Wouters, D. ; Groeseneken, G. ; Biesemans, S.

  • Author_Institution
    IMEC, Leuven
  • fYear
    2008
  • fDate
    17-19 June 2008
  • Firstpage
    162
  • Lastpage
    163
  • Abstract
    For the first time, after considering the thermodynamic properties (evaluated by the molar Gibbs energy of oxide formation, DeltaOxideG) and the electronegativity (chi) for both the dopants (via ion implantation, thin capping layer or co-deposition) and host materials in the gate stack, a practical model to understand the effective work function (EWF) modulation induced by various dopants is proposed. It is found that the dopant oxide will determine the EWF if the DeltaOxideG of dopant (DeltaOx-dopG) is more negative than that of host gate oxide (DeltaOx-hostG). Or else, chi difference between dopants and host materials will play a more critical role for determining the EWF. This model can serve as a guideline for understanding the EWF modulation by various dopants and to select appropriate gate stack materials for the gate-first technology.
  • Keywords
    electronegativity; free energy; ion implantation; work function; EWF modulation; co-deposition; dopants; effective work function; electronegativity; gate stack; gate-first integration; ion implantation; molar Gibbs energy; thermodynamic properties; thin capping layer; CMOS technology; Channel bank filters; High K dielectric materials; High-K gate dielectrics; Predictive models; Semiconductor process modeling; Solid modeling; Temperature; Thermal stability; Thermodynamics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, 2008 Symposium on
  • Conference_Location
    Honolulu, HI
  • Print_ISBN
    978-1-4244-1802-2
  • Electronic_ISBN
    978-1-4244-1803-9
  • Type

    conf

  • DOI
    10.1109/VLSIT.2008.4588603
  • Filename
    4588603