Revolutionary NanoSilicon Ancillary Technologies for Ultimate-Performance Gigascale Systems

Author

Bakir, Muhannad S. ; Dang, Bing ; Meindl, James D.

Author_Institution

Georgia Inst. of Technol., Atlanta

fYear

2007

fDate

16-19 Sept. 2007

Firstpage

421

Lastpage

428

Abstract

This paper describes electrical, optical, and fluidic (or ´trimodal´) chip I/O interconnect networks for gigascale systems to meet and exceed end-of-roadmap projections in the areas of power delivery, off-chip bandwidth, and heat removal, respectively. The trimodal I/O technology is proposed to overcome the adverse effects of conventional silicon ancillary technologies on the performance of a gigascale system. We describe trimodal I/O interconnect configurations, fabrication, assembly, and testing.

Keywords

integrated circuit interconnections; integrated optoelectronics; nanoelectronics; I/O interconnect networks; electrical chip; fluidic chip; heat removal; off-chip bandwidth; optical chip; power delivery; revolutionary nanosilicon ancillary technologies; trimodal chip; ultimate-performance gigascale systems; Bandwidth; Heat sinks; Integrated circuit interconnections; Microprocessors; Optical interconnections; Power system interconnection; Resistance heating; Silicon; System-on-a-chip; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Custom Integrated Circuits Conference, 2007. CICC '07. IEEE

Conference_Location

San Jose, CA

Print_ISBN

978-1-4244-1623-3

Electronic_ISBN

978-1-4244-1623-3

Type

conf

DOI

10.1109/CICC.2007.4405766

Filename

4405766