Study of sparkover issue in packaging

A premature failure has been investigated and proved to be caused by the sparkover between no-connect metal cover and chip of ceramic packaging. Sparkover-induced model with the parasitic parameters of human body and ESD(electrostatic discharge) tester was created to explain the failure mechanism. Simulation and experiment were performed to verify the models´ accuracy. Furthermore, the first peak and second peak of the discharge current were studied by experimenting on printed circuit board designed on the basis of sparkover-induced model. The results show the discharge current is influenced by a series of parameters, such as spacing, area, parasitic capacitance and so on.