• DocumentCode
    2415281
  • Title

    Improving the genetic algorithm performance in aerial spray deposition management

  • Author

    Wu, L. ; Potter, W.D. ; Rasheed, K. ; Ghent, J. ; Twardus, D. ; Thistle, H. ; Teske, M.

  • Author_Institution
    Georgia Univ., Athens, GA, USA
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    306
  • Lastpage
    311
  • Abstract
    Determining the parameter value settings to use as input to AGDISP (aerial spray simulation model) in order to produce a desired spray material deposition is considered an instance of the parametric design problem. SAGA (spray advisor using genetic algorithm) was developed to solve this problem. In this paper, we describe several approaches to improve the performance of SAGA. First, we replace the original generational genetic algorithm with a steady-state genetic algorithm, and the original roulette wheel selection with tournament selection. We call the new system SAGA2. Second, we apply a neural network to improve the initial population, crossover, and mutation. We call this version SAGA2NN. Then, we apply GADO, a general-purpose approach to solving the parametric design problem. The integrated GADO version is called SAGADO. Finally, we compare the performance of SAGA, SAGA2, SAGA2NN and SAGADO
  • Keywords
    agriculture; digital simulation; genetic algorithms; neural net architecture; spray coatings; sprays; AGDISP; GADO; SAGA; SAGA2; SAGA2NN; aerial spray deposition management; aerial spray simulation model; crossover; genetic algorithm performance; initial population; mutation; neural network; parameter optimization; parameter value settings; parametric design problem; pesticide sprays; steady-state genetic algorithm; tournament selection; Aerospace materials; Aircraft; Algorithm design and analysis; Design optimization; Engines; Genetic algorithms; Neural networks; Predictive models; Spraying; US Department of Agriculture;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SoutheastCon, 2002. Proceedings IEEE
  • Conference_Location
    Columbia, SC
  • Print_ISBN
    0-7803-7252-2
  • Type

    conf

  • DOI
    10.1109/.2002.995610
  • Filename
    995610