• DocumentCode
    241572
  • Title

    Latest advances in gallium nitride HEMT modeling

  • Author

    Qiang Chen

  • Author_Institution
    Keysight Technol., Keysight Technol., Inc., Santa Clara, CA, USA
  • fYear
    2014
  • fDate
    28-31 Oct. 2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    GaN-based high electron mobility transistor (HEMT) has been considered as the next-generation technology for high-frequency/high-power and high-speed/high-voltage applications. This paper discusses the needs and challenges for advanced GaN HEMT models, and reviews latest advances by focusing on Compact Model Coalition´s (CMC) newly launched effort on GaN HEMT model standardization and DynaFET, a unique characterization and modeling methodology that uses large-signal waveform measurement as a central input. Distinct technical approaches in DynaFET and CMC´s candidate models (the Angelov-GaN model, the COMON model, the HSP model, and the MVSG-HV model) are highlighted.
  • Keywords
    III-V semiconductors; gallium compounds; high electron mobility transistors; semiconductor device models; wide band gap semiconductors; Angelov-GaN model; COMON model; DynaFET; GaN; HEMT modeling; HSP model; MVSG-HV model; compact model coalition; high electron mobility transistor; Gallium nitride; HEMTs; Integrated circuit modeling; Load modeling; Semiconductor device modeling; Standardization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology (ICSICT), 2014 12th IEEE International Conference on
  • Conference_Location
    Guilin
  • Print_ISBN
    978-1-4799-3296-2
  • Type

    conf

  • DOI
    10.1109/ICSICT.2014.7021208
  • Filename
    7021208