DocumentCode
241572
Title
Latest advances in gallium nitride HEMT modeling
Author
Qiang Chen
Author_Institution
Keysight Technol., Keysight Technol., Inc., Santa Clara, CA, USA
fYear
2014
fDate
28-31 Oct. 2014
Firstpage
1
Lastpage
4
Abstract
GaN-based high electron mobility transistor (HEMT) has been considered as the next-generation technology for high-frequency/high-power and high-speed/high-voltage applications. This paper discusses the needs and challenges for advanced GaN HEMT models, and reviews latest advances by focusing on Compact Model Coalition´s (CMC) newly launched effort on GaN HEMT model standardization and DynaFET, a unique characterization and modeling methodology that uses large-signal waveform measurement as a central input. Distinct technical approaches in DynaFET and CMC´s candidate models (the Angelov-GaN model, the COMON model, the HSP model, and the MVSG-HV model) are highlighted.
Keywords
III-V semiconductors; gallium compounds; high electron mobility transistors; semiconductor device models; wide band gap semiconductors; Angelov-GaN model; COMON model; DynaFET; GaN; HEMT modeling; HSP model; MVSG-HV model; compact model coalition; high electron mobility transistor; Gallium nitride; HEMTs; Integrated circuit modeling; Load modeling; Semiconductor device modeling; Standardization;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology (ICSICT), 2014 12th IEEE International Conference on
Conference_Location
Guilin
Print_ISBN
978-1-4799-3296-2
Type
conf
DOI
10.1109/ICSICT.2014.7021208
Filename
7021208
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