Title :
Soft errors and NBTI in SiGe pMOS transistors
Author :
Fleetwood, D.M. ; Zhang, E.X. ; Duan, G.X. ; Zhang, C.X. ; Samsel, I.K. ; Hooten, N.C. ; Bennett, W.G. ; Schrimpf, R.D. ; Reed, R.A. ; Linten, D. ; Mitard, J.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Vanderbilt Univ., Nashville, TN, USA
Abstract :
We have investigated single event charge collection and negative-bias instabilities in SiGe pMOSFETs that are of interest for future commercial and space applications. Single-event transient (SET) pulse polarity can depend on the location of the strike along the device channel in ways that differ from SETs in Si-based CMOS devices. The drain bias can significantly affect the total amount of collected charge and peak current values of the SETs in the tested devices. Activation energies for interface-trap buildup during negative bias-temperature stress are lower for SiGe channel pMOSFETs than for Si channel pMOSFETs. Activation energies for oxide-trap charge buildup during negative bias-temperature stress are similar for SiGe pMOSFETs and Si pMOSFETs.
Keywords :
CMOS integrated circuits; Ge-Si alloys; MOSFET; elemental semiconductors; interface states; radiation hardening (electronics); semiconductor device reliability; silicon; CMOS devices; NBTI; Si; SiGe; interface-trap buildup; negative bias-temperature stress; negative-bias instabilities; oxide-trap charge buildup; pMOS transistors; pMOSFET; single event charge collection; single-event transient pulse polarity; soft errors; Abstracts; Hafnium compounds; Logic gates; MOSFET circuits; Silicon; Stress; Tin;
Conference_Titel :
Solid-State and Integrated Circuit Technology (ICSICT), 2014 12th IEEE International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4799-3296-2
DOI :
10.1109/ICSICT.2014.7021225