Title :
Physical Model for Power Supply Noise and Chip/Package Co-Design in Gigascale Systems with the Consideration of Hot Spots
Author :
Huang, Gang ; Sekar, D. ; Naeemi, Azad ; Shakeri, Kaveh ; Meindl, J.D.
Author_Institution :
Georgia Inst. of Technol., Atlanta
Abstract :
An analytical physical model is derived for the first time to predict the first droop power supply noise for non-uniform current switching conditions and arbitrary functional block sizes. The model not only captures the impact of package parameters and the distributed nature of power grid and decoupling capacitance but also addresses the non-uniformity problem for the power density distribution brought by hot spots. A case study shows that both the frequency domain power noise model and the projected peak noise value have less than 1% error comparing with SPICE simulation.
Keywords :
frequency-domain analysis; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; SPICE simulation; arbitrary functional block sizes; chip/package co-design; decoupling capacitance; frequency domain power noise model; gigascale systems; hot spots; nonuniform current switching conditions; nonuniformity problem; package parameters; power density distribution; power grid; power supply noise; projected peak noise value; Analytical models; Capacitance; Circuits; Power supplies; Power system modeling; Predictive models; Semiconductor device noise; Semiconductor device packaging; USA Councils; Wire;
Conference_Titel :
Custom Integrated Circuits Conference, 2007. CICC '07. IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-1623-3
Electronic_ISBN :
978-1-4244-1623-3
DOI :
10.1109/CICC.2007.4405859
