DocumentCode :
2417021
Title :
Coupling aware power estimation for on-chip VLSI distributed RLCG global interconnects using model order reduction technique
Author :
Kar, Rajib ; Maheshwari, V. ; Choudhary, Aman ; Singh, Abhishek ; Mal, Ashis K. ; Bhattacharjee, A.K.
Author_Institution :
Dept. of Electron. & Commun. Eng., Nat. Inst. of Technol., Durgapur, India
fYear :
2010
fDate :
29-31 July 2010
Firstpage :
1
Lastpage :
7
Abstract :
In this paper, we have derived a closed form formula for the power dissipation in highly coupled distributed RLCG interconnects taking the mutual inductive coupling into account. Power is increasingly becoming the bottleneck for the design of high performance VLSI circuits. It is essential to analyze how the various components of power are likely to scale in the future, thereby identifying the key problematic areas. While most of the analysis focus on the timing aspects of interconnects, power consumption is also an important issue to be addressed and modeled accurately. In this paper, estimation of the power dissipation of interconnects is studied using a reduced-order model. The relation between power consumption and the poles and residues of a transfer function is derived, and an appropriate driver model is developed, allowing power consumption to be computed efficiently. The results obtained from SPICE and from that of using our approach, justify the accuracy and the effectiveness of our proposed model.
Keywords :
VLSI; integrated circuit interconnections; power consumption; reduced order systems; coupling aware power estimation; model order reduction technique; mutual inductive coupling; on-chip VLSI distributed RLCG global interconnects; Estimation; Inductance; Integrated circuit interconnections; Integrated circuit modeling; Laplace equations; Mathematical model; Reduced order systems; Inductive Coupling; Model Order Reduction; Moment Matching; Power Estimation; RLCG Interconnect; VLSI;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computing Communication and Networking Technologies (ICCCNT), 2010 International Conference on
Conference_Location :
Karur
Print_ISBN :
978-1-4244-6591-0
Type :
conf
DOI :
10.1109/ICCCNT.2010.5591706
Filename :
5591706
Link To Document :
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