Title :
Thermooxidation degradation and life prediction of nitrile butadiene rubber based on Kinetics model
Author :
Zhang Kun ; Yao Jinyong ; Jiang Tonming
Author_Institution :
Sch. of Reliability & Syst. Eng., Beijing Univ. of Aeronaut. & Astronaut., Beijing, China
Abstract :
To study the aging principle of sealing performance of nitrile butadiene rubber (NBR), a mathematical model is proposed based on the correlation between mechanical performance and microscopic flaws. We assume that oxidative cross-linking and molecular chain scission are two main microscopic flaws of NBR, which could result in performance degradation. In this paper, we use Kinetics model to relate the degradation process with both microscopic flaw mechanisms. Finally thermal-oxidative aging model of NBR is developed for lifetime evaluation. We evaluate our model using compression permanent distortion data which are obtained by accelerated thermal-oxidative aging tests at 60°, 70°, 80°, 90° and 100°. Comparing with current existing aging model, the experimental results show that our model could simulate the degradation trend of sealing performance accurately. Predictive residual of our model is smaller than 1% at various temperatures and even smaller than P-t model at 70° and 80°.
Keywords :
ageing; compressive testing; flaw detection; life testing; oxidation; rubber; sealing materials; NBR; accelerated thermal-oxidative aging tests; aging principle; compression permanent distortion data; kinetics model; life prediction; lifetime evaluation; mathematical model; mechanical performance; microscopic flaw mechanisms; molecular chain scission; nitrile butadiene rubber; oxidative cross-linking; sealing performance degradation; temperature 60 degC to 100 degC; thermal-oxidative aging model; thermooxidation degradation; Aging; Degradation; Kinetic theory; Materials; Microscopy; Predictive models; Rubber; Kinetics; microscopic flaws; nitrile butadiene rubber; thermal-oxidative aging;
Conference_Titel :
Industrial Engineering and Engineering Management (IEEM), 2012 IEEE International Conference on
Conference_Location :
Hong Kong
DOI :
10.1109/IEEM.2012.6837846