DocumentCode
2418417
Title
The Simulation for Pressure Loss of Microchannel Heat Sinks Inlet
Author
Lou, Wenzhong ; Yu, Xiuli ; Qi, Bin
Author_Institution
Sch. of Mechatronic Eng., Beijing Inst. of Technol.
fYear
2007
fDate
16-19 Jan. 2007
Firstpage
1
Lastpage
6
Abstract
Microchannel device is one of the prominent applications in micro and nano technologies. Basic theory for micro fluid is developing, but pressure loss in inlet and outlet of microchannel is paid little attention. Some researches show that the pressure loss in microchannel is only 10 percent, while that in inlet and outlet is up to 90 percent. So it becomes more important to analyze the pressure loss in inlet and outlet. Computer simulation can be used effectively to forecast the transport properties in micro-scale, and to give some estimates to new devices before they are manufactured. In this paper some kind shape of inlet was modeled and simulated, pressure distribution data in inlet area were acquired. By simulation analysis, we reckon that the pressure loss made by flow resistance is about 13.58 percent, made by flow direction change is about 48.58 percent, and made by cross section change is almost 37.84 percent.
Keywords
heat sinks; microchannel flow; microchannel heat sinks inlet; pressure distribution; pressure loss simulation; transport properties; Circuits; Computational modeling; Computer aided manufacturing; Computer simulation; Cooling; Heat sinks; Heat transfer; Microchannel; Power system reliability; Virtual manufacturing; Micro-simulation; inlet; microchannel; pressure loss;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems, 2007. NEMS '07. 2nd IEEE International Conference on
Conference_Location
Bangkok
Print_ISBN
1-4244-0610-2
Type
conf
DOI
10.1109/NEMS.2007.351999
Filename
4160324
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