• DocumentCode
    2418417
  • Title

    The Simulation for Pressure Loss of Microchannel Heat Sinks Inlet

  • Author

    Lou, Wenzhong ; Yu, Xiuli ; Qi, Bin

  • Author_Institution
    Sch. of Mechatronic Eng., Beijing Inst. of Technol.
  • fYear
    2007
  • fDate
    16-19 Jan. 2007
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Microchannel device is one of the prominent applications in micro and nano technologies. Basic theory for micro fluid is developing, but pressure loss in inlet and outlet of microchannel is paid little attention. Some researches show that the pressure loss in microchannel is only 10 percent, while that in inlet and outlet is up to 90 percent. So it becomes more important to analyze the pressure loss in inlet and outlet. Computer simulation can be used effectively to forecast the transport properties in micro-scale, and to give some estimates to new devices before they are manufactured. In this paper some kind shape of inlet was modeled and simulated, pressure distribution data in inlet area were acquired. By simulation analysis, we reckon that the pressure loss made by flow resistance is about 13.58 percent, made by flow direction change is about 48.58 percent, and made by cross section change is almost 37.84 percent.
  • Keywords
    heat sinks; microchannel flow; microchannel heat sinks inlet; pressure distribution; pressure loss simulation; transport properties; Circuits; Computational modeling; Computer aided manufacturing; Computer simulation; Cooling; Heat sinks; Heat transfer; Microchannel; Power system reliability; Virtual manufacturing; Micro-simulation; inlet; microchannel; pressure loss;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2007. NEMS '07. 2nd IEEE International Conference on
  • Conference_Location
    Bangkok
  • Print_ISBN
    1-4244-0610-2
  • Type

    conf

  • DOI
    10.1109/NEMS.2007.351999
  • Filename
    4160324