3D RC modeling of substrate coupling noise in high-speed Flash A/D converters

Author

Yongsheng Wang ; Hualing Yang ; Min Wang ; Yunfei Du

Author_Institution

Micro-Electron. Dept., Harbin Inst. of Technol., Harbin, China

fYear

2014

fDate

28-31 Oct. 2014

Firstpage

1

Lastpage

3

Abstract

Substrate coupling noise is a key problem in today´s large mixed-signal systems. This noise is caused by the coupling of digital part and can propagate to analog circuits through the common substrate. The estimating and accurate modeling of noise coupling effects is a major challenge for designers. In this paper, method of 3D distributed resistive-capacitive is used to modeling the substrate, meanwhile power/ground network models are built. Also the noise injection is got by the ring oscillator which can inject noise more real. Finally, the above models are applied in a high-speed Flash ADC and then quantifying the impact of substrate coupling noise on the performance of the circuit.

Keywords

RC circuits; analogue-digital conversion; high-speed integrated circuits; integrated circuit noise; mixed analogue-digital integrated circuits; oscillators; rings (structures); three-dimensional integrated circuits; 3D RC modeling; 3D distributed resistive-capacitive; analog circuits propagation; circuit performance; high-speed flash A/D converters; mixed-signal systems; noise injection; power-ground network models; ring oscillator; substrate digital coupling noise effect; Capacitance; Couplings; Integrated circuit modeling; Noise; Solid modeling; Substrates; Three-dimensional displays; 3D RC model; substrate coupling noise;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State and Integrated Circuit Technology (ICSICT), 2014 12th IEEE International Conference on

Conference_Location

Guilin

Print_ISBN

978-1-4799-3296-2

Type

conf

DOI

10.1109/ICSICT.2014.7021395

Filename

7021395