DocumentCode :
2420092
Title :
Influence of the cure parameters on the partial discharge behavior of cast resins
Author :
Kotte, Ralf ; Gockenbach, Emst ; Borsi, Hossein
Author_Institution :
Div. of High Voltage Eng., Hannover Univ., Germany
fYear :
2002
fDate :
7-10 Apr 2002
Firstpage :
387
Lastpage :
390
Abstract :
Experimental investigations concerning the influence of the cure parameters on the partial discharge inception voltage (PDIV) of four heat-resistant cast resin systems are presented and discussed in this paper. The tests were performed on two epoxy resin systems in combination with silica flour and wollastonite, respectively, with different post-cure parameters. The PDIV was measured in a nonuniform electrical field in dependence on the temperature. The contribution reveals that a raise of the cure temperature can lead to a significant decline of the PDIV.
Keywords :
casting; epoxy insulation; insulation testing; partial discharge measurement; cast resins; cure parameters; epoxy resin systems; heat-resistant cast resin systems; nonuniform electrical field; partial discharge behavior; partial discharge inception voltage; silica flour; wollastonite; Dielectric materials; Dielectrics and electrical insulation; Epoxy resins; Partial discharges; Power transformer insulation; Silicon compounds; System testing; Temperature; Thermal stresses; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation, 2002. Conference Record of the 2002 IEEE International Symposium on
Print_ISBN :
0-7803-7337-5
Type :
conf
DOI :
10.1109/ELINSL.2002.995957
Filename :
995957
Link To Document :
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