Influence of the cure parameters on the partial discharge behavior of cast resins

Author

Kotte, Ralf ; Gockenbach, Emst ; Borsi, Hossein

Author_Institution

Div. of High Voltage Eng., Hannover Univ., Germany

fYear

2002

fDate

7-10 Apr 2002

Firstpage

387

Lastpage

390

Abstract

Experimental investigations concerning the influence of the cure parameters on the partial discharge inception voltage (PDIV) of four heat-resistant cast resin systems are presented and discussed in this paper. The tests were performed on two epoxy resin systems in combination with silica flour and wollastonite, respectively, with different post-cure parameters. The PDIV was measured in a nonuniform electrical field in dependence on the temperature. The contribution reveals that a raise of the cure temperature can lead to a significant decline of the PDIV.

Keywords

casting; epoxy insulation; insulation testing; partial discharge measurement; cast resins; cure parameters; epoxy resin systems; heat-resistant cast resin systems; nonuniform electrical field; partial discharge behavior; partial discharge inception voltage; silica flour; wollastonite; Dielectric materials; Dielectrics and electrical insulation; Epoxy resins; Partial discharges; Power transformer insulation; Silicon compounds; System testing; Temperature; Thermal stresses; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Insulation, 2002. Conference Record of the 2002 IEEE International Symposium on

Print_ISBN

0-7803-7337-5

Type

conf

DOI

10.1109/ELINSL.2002.995957

Filename

995957