DocumentCode :
2420129
Title :
Stress loading test facility
Author :
Kohlbacher, Howard
Author_Institution :
Bell Tech. Operations Corp., Fort Huachuca, AZ, USA
fYear :
1989
fDate :
23-25 May 1989
Firstpage :
410
Lastpage :
413
Abstract :
The need to conduct realistic, efficient EMC system tests on large command, control, communications, and intelligence (C3I) systems has led to the development of a stress loading facility (SLF) by the US Army Electronic Proving Ground at Fort Huachuca, Arizona. The SLF is a low-power, radio-frequency (RF), hardware simulation facility for testing the response of electronic equipment to realistic densities of RF signals, while simultaneously monitoring key system under test (SUT) performance parameters. The SLF generates a simulated RF environment based on a time-event scenario that is developed during the pretest period. The RF environment also includes the associated modulations and types of information that would be transmitted by this RF environment. The system, function, and components that are associated with the SUT to allow it to operate realistically and are not physically available for the test are simulated within the SLF. The facility is used to evaluate message traffic and electromagnetic stress. Environmental and mechanical stresses are not considered
Keywords :
automatic test equipment; command and control systems; digital simulation; electromagnetic compatibility; military systems; Arizona; C3I systems; EMC; Fort Huachuca; RF hardware simulation facility; RF signals; US Army Electronic Proving Ground; command and control systems; communication systems; electromagnetic stress; electronic equipment response; intelligence systems; low power facility; message traffic; modulations; performance parameters; simulated RF environment; stress loading facility; system under test; Communication system control; Control systems; Electromagnetic compatibility; Electronic equipment testing; Hardware; Intelligent control; Radio frequency; Stress control; System testing; Test facilities;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility, 1989., IEEE 1989 National Symposium on
Conference_Location :
Denver, CO
Type :
conf
DOI :
10.1109/NSEMC.1989.37220
Filename :
37220
Link To Document :
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