• DocumentCode
    242017
  • Title

    A radiation hardened scan flip-flop design with built-in soft error resilience

  • Author

    Qiushi Wang ; Lin Jin

  • Author_Institution
    No. 38 Res. Inst., IC Design Center, CETC, Hefei, China
  • fYear
    2014
  • fDate
    28-31 Oct. 2014
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    This paper presents a built-in soft error resilience (BISER) technique for correcting radiation-induced soft errors in scan flip-flop. The proposed radiation hardened scan flip-flop design (RH-SFF) takes use of time redundancy and space redundancy, which can tolerate soft error in sequential element and achieve about 20-fold reduction in SER of combinational logic, according to the circuit simulations using the an advanced 28nm technology. Comparing to the existing BISER flip-flop design, RH-SFF reduces the number of scan clock from 5 to 1, which enables the IC chips using the presented technique to be more testable in automatic test equipment (ATE), while achieves the same functions and delivers improved area, speed and power efficient.
  • Keywords
    automatic test equipment; combinational circuits; flip-flops; logic design; radiation hardening (electronics); redundancy; sequential circuits; 20-fold reduction; ATE; BISER flip-flop design technique; IC chips; RH-SFF; SER; advanced technology; area improvement; automatic test equipment; built-in soft error resilience; circuit simulations; combinational logic; power efficient improvement; radiation hardened scan flip-flop design; radiation-induced soft errors; scan clock; sequential element; size 28 nm; space redundancy; speed improvedment; time redundancy; Clocks; Error correction; Flip-flops; Integrated circuits; Latches; Radiation hardening (electronics); Resilience;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology (ICSICT), 2014 12th IEEE International Conference on
  • Conference_Location
    Guilin
  • Print_ISBN
    978-1-4799-3296-2
  • Type

    conf

  • DOI
    10.1109/ICSICT.2014.7021435
  • Filename
    7021435