Advancing materials using interfacial process and reliability simulations on the molecular level

A family of molecular modeling methods has been constructed to help Honeywell scientists understand the underlying interfacial physics that contribute to adhesion and reliability measurements. In this paper we will cover aspects of molecular modeling for wetting and adhesion, and expand the topic toward reliability modeling from the molecular scale. In addition we will discuss the practical applications of these methods that demonstrate Honeywell´s commitment toward advancing materials and their properties. For instance our studies of bleed and flow has helped us understand surface energy correlations, but have also helped us understand the limitations of depending upon bleed and even surface energy as single predictive measurements. Reliability molecular modeling on the other hand is a relatively new technique, recently introduced at the 32^nd IMAPS conference in Chicago. This technique which uses a cyclic strain to simulate stress cycling has helped us understand the ties of the molecular level to the engineering level. These types of correlations have been an aid to both the formulation chemist and the reliability engineer who need to understand the possible material weaknesses before extended buildup of a structure is done