Title :
Heterogeneous 3D integration for Internet of Things
Author :
Koyanagi, Mitsumasa
Author_Institution :
New Ind. Creation Hatchery Center, Tohoku Univ., Sendai, Japan
Abstract :
To overcome various concerns caused by scaling-down the device size in future LSIs, it is indispensable to introduce a new concept of heterogeneous 3D integration in which various kinds of device chips with different size, different devices and different materials are vertically stacked. To achieve such heterogeneous 3D integration, a key technology of self-assembly and electrostatic (SAE) bonding has been developed. Exploring new devices for the IoT, we have fabricated several kinds of heterogeneous 3D LSIs called super-chip by stacking compound semiconductor device chip, photonic device chip and spintronic device chip on CMOS device chips using SAE bonding.
Keywords :
CMOS integrated circuits; Internet of Things; integrated circuit manufacture; large scale integration; self-assembly; three-dimensional integrated circuits; 3D LSI; CMOS device chips; Internet of Things; SAE bonding; electrostatic bonding; heterogeneous 3D integration; photonic device chip; self-assembly; semiconductor device chip; spintronic device chip; super-chip; CMOS integrated circuits; Integrated optics; Optical imaging; Optical sensors; Photonics; Three-dimensional displays; Through-silicon vias;
Conference_Titel :
Solid-State and Integrated Circuit Technology (ICSICT), 2014 12th IEEE International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4799-3296-2
DOI :
10.1109/ICSICT.2014.7021442
