Title :
Simplified empirical formula on TSV thermal analysis for 3D IC EDA
Author :
Bo Lu ; Ligang Hou ; Jingyan Fu ; Jinhui Wang
Author_Institution :
Integrated Circuits & Syst. Integration of Sci., Beijing Univ. of Technol., Beijing, China
Abstract :
In this paper, based on the formulas of the classic theory of heat conduction, proposed a temperature distribution formula in the three-dimensional space, which can effectively and accurately calculated the temperature value at any coordinate-point within the TSV (Through Silicon Via) model. By simulating the behavior of heat conduction and analyzing temperature data, this paper proposed the simplified empirical formula of temperature distribution for analyzing in 3D IC, and compared the calculated value with the simulation value to validate. These results will be easy to estimate the range of temperature change for EDA toll.
Keywords :
electronic design automation; heat conduction; thermal analysis; three-dimensional integrated circuits; 3D IC EDA; TSV thermal analysis; heat conduction; temperature distribution formula; through silicon via model; Integrated circuit modeling; Silicon; Space heating; Temperature distribution; Thermal conductivity; Three-dimensional displays;
Conference_Titel :
Solid-State and Integrated Circuit Technology (ICSICT), 2014 12th IEEE International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4799-3296-2
DOI :
10.1109/ICSICT.2014.7021446
