Simplified empirical formula on TSV thermal analysis for 3D IC EDA

Author

Bo Lu ; Ligang Hou ; Jingyan Fu ; Jinhui Wang

Author_Institution

Integrated Circuits & Syst. Integration of Sci., Beijing Univ. of Technol., Beijing, China

fYear

2014

fDate

28-31 Oct. 2014

Firstpage

1

Lastpage

3

Abstract

In this paper, based on the formulas of the classic theory of heat conduction, proposed a temperature distribution formula in the three-dimensional space, which can effectively and accurately calculated the temperature value at any coordinate-point within the TSV (Through Silicon Via) model. By simulating the behavior of heat conduction and analyzing temperature data, this paper proposed the simplified empirical formula of temperature distribution for analyzing in 3D IC, and compared the calculated value with the simulation value to validate. These results will be easy to estimate the range of temperature change for EDA toll.

Keywords

electronic design automation; heat conduction; thermal analysis; three-dimensional integrated circuits; 3D IC EDA; TSV thermal analysis; heat conduction; temperature distribution formula; through silicon via model; Integrated circuit modeling; Silicon; Space heating; Temperature distribution; Thermal conductivity; Three-dimensional displays;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State and Integrated Circuit Technology (ICSICT), 2014 12th IEEE International Conference on

Conference_Location

Guilin

Print_ISBN

978-1-4799-3296-2

Type

conf

DOI

10.1109/ICSICT.2014.7021446

Filename

7021446