Adhesion studies of polyimide-epoxy interfaces in flip chip assemblies

Author

Pearson, R.A. ; Lloyd, T.B.

Author_Institution

Microelectron. Packaging Mater. Lab., Lehigh Univ., Bethlehem, PA, USA

fYear

2000

fDate

2000

Firstpage

58

Lastpage

62

Abstract

The adhesive strength between underfill resins and organic passivation layers is controlled by the molecular interactions occurring at the interface and the plastic deformation mechanisms occurring in the underfill resin. Therefore, improvement in reliability can be realized by selecting tough underfill resins with the proper chemistry to interact with the specific organic passivation layer chosen. Surface treatment of the organic passivation coating can improve adhesion in cases were the inherent molecular interactions are weak

Keywords

adhesives; encapsulation; flip-chip devices; integrated circuit reliability; passivation; plastic deformation; adhesive strength; flip chip assemblies; molecular interactions; organic passivation layers; plastic deformation mechanisms; polyimide-epoxy interfaces; reliability; surface treatment; underfill resins; Adhesives; Assembly; Dispersion; Flip chip; Microelectronics; Packaging; Polyimides; Polymers; Probes; Thermodynamics;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on

Conference_Location

Braselton, GA

Print_ISBN

0-930815-59-9

Type

conf

DOI

10.1109/ISAPM.2000.869243

Filename

869243