• DocumentCode
    242045
  • Title

    Impacts of substrate heating schemes on characteristics of amorphous indium-gallium-zinc-oxide (a-IGZO) TFTs fabricated on flexible substrates

  • Author

    Xiang Xiao ; Lei Xie ; Yang Shao ; Xin He ; Peng Zhang ; Weizhi Meng ; Zheyuan Chen ; Wei Deng ; Letao Zhang ; Shengdong Zhang

  • Author_Institution
    Sch. of Electron. & Comput. Eng., Peking Univ., Shenzhen, China
  • fYear
    2014
  • fDate
    28-31 Oct. 2014
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    The impacts of substrate heating scheme on the characteristics of amorphous indium-gallium-zinc-oxide (a-IGZO) TFTs fabricated on flexible PEN substrate are investigated. For the a-IGZO TFTs fabrication, the substrate is heated during the a-IGZO deposition, pre-annealing in N2 is also conducted before passivation layer deposition, and post-annealing is done at last. The results show that the pre-annealing and post-annealing improve the hysteresis characteristics, but degrade the field-effect mobility μFE and subthreshold swing SS. In contrast, both the hysteresis voltage Vh and the electrical performance are enhanced when the a-IGZO is sputtered with substrate temperature of 150°C. The major performance parameters μFE, SS, and Vh are 7.34 cm2/Vs, 0.438 V/dec, and 2.3 V, respectively.
  • Keywords
    II-VI semiconductors; amorphous semiconductors; annealing; flexible electronics; gallium compounds; indium compounds; passivation; semiconductor device manufacture; semiconductor device testing; sputter deposition; thin film transistors; wide band gap semiconductors; zinc compounds; InGaZnO; a-IGZO TFT; a-IGZO deposition; amorphous indium-gallium-zinc-oxide TFT; field-effect mobility; flexible PEN substrate; flexible substrates; hysteresis voltage; passivation layer deposition; postannealing; preannealing; substrate heating schemes; subthreshold swing; temperature 150 degC; thin film transistors; voltage 2.3 V; Abstracts; Annealing; Dielectrics; Glass; Performance evaluation; Robustness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated Circuit Technology (ICSICT), 2014 12th IEEE International Conference on
  • Conference_Location
    Guilin
  • Print_ISBN
    978-1-4799-3296-2
  • Type

    conf

  • DOI
    10.1109/ICSICT.2014.7021449
  • Filename
    7021449