Title :
Adhesion characterization of no flow underfill baselined with fast flow snap cure
Author :
Lu, Jicun ; Smith, Brian ; Baldwin, Daniel F.
Author_Institution :
George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
Adhesion of underfill is critical to the reliability of a flip chip assembly. This paper focuses on characterization of underfill adhesion between underfill and Si3N4 passivated chip based on shear testing. A new die shear test vehicle is developed. The adhesion of a no flow underfill before and after post baking is investigated. It was found that post baking enhances the adhesion of the no flow underfill studied significantly. After post baking, the no flow underfill has similar adhesion to the passivated chip compared to a fast flow snap cure underfill used as baselines. In addition, the failure mode in the shear tests shifts from combined adhesive and cohesive failure in non-post-baked samples with no flow underfill, to underfill/substrate interface fracture in post baked samples
Keywords :
adhesion; encapsulation; flip-chip devices; fracture; integrated circuit reliability; passivation; Si3N4; adhesion characterization; die shear test vehicle; failure mode; fast flow snap cure; flip chip assembly; interface fracture; no flow underfill; passivated chip; post baking; reliability; shear testing; Adhesives; Assembly; Flip chip; Glass; Passivation; Silicon; Soldering; Substrates; Testing; Vehicles;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-930815-59-9
DOI :
10.1109/ISAPM.2000.869246
