Title :
Evaluation of the environmental protection of photo BCB polymers (CycloteneTM 4000)
Author :
Wu, Jaili ; Pike, Randy ; Wong, C.P. ; Scheck, Daniel ; Rogers, W. Boyd ; Garrou, Philip
Author_Institution :
Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
With the demand for higher interconnect density increasing, the ability of polymeric insulation to resist current flow and protect circuits from corrosion is becoming more and more important. BCB polymer is being used commercially on many high density devices which must function in non-hermetic environments. It was therefore of interest to quantify the change in resistance and leakage current (under temp-humidity-bias), of BCB encapsulated circuits by conducting surface insulation resistance (SIR) and triple track testing (TTT). SIR of all the Cyclotene samples ranged from 7.5×108 to 8.8×109 Ω. TTT reveals stable resistance of all samples past 500 hours. Leakage current measurements of ⩽4×10 -11 amperes were observed. The BCB samples show results equal to or better than the Dow Corning vulcanized rubber control, indicating excellent circuit protection capability
Keywords :
corrosion protective coatings; encapsulation; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; leakage currents; life testing; 7.5E8 to 8.8E9 ohm; BCB polymer; Cyclotene 4000; circuit protection capability; corrosion protection; encapsulated circuits; environmental protection; interconnect density; leakage current; polymeric insulation; surface insulation resistance; triple track testing; Circuit testing; Corrosion; Insulation life; Integrated circuit interconnections; Leakage current; Plastic insulation; Polymers; Protection; Resists; Surface resistance;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-930815-59-9
DOI :
10.1109/ISAPM.2000.869249
