Title :
Novel single pass reflow encapsulant for flip chip application
Author :
Wang, Hui ; Tomaso, Torey
Author_Institution :
Kester Solder, Litton Syst. Inc., Des Plaines, IL, USA
Abstract :
A series of novel single pass reflow encapsulants with varied Tg´s below 125°C were investigated under multiple testing methods. The single pass reflow encapsulant with the lowest Tg (65°C) showed some of the best reliability, passing over 1000 cycles of LLTC (-55° to 125°C) testing. These results indicate that the Tg and CTE of the encapsulant are important but not critical parameters to the reliability of the flip chip package with single pass reflow encapsulants
Keywords :
encapsulation; flip-chip devices; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; thermal expansion; -55 to 125 degC; CTE; LLTC testing; flip chip package; liquid-to-liquid thermal cycle; multiple testing methods; reliability; single pass reflow encapsulant; Assembly; Encapsulation; Flip chip; Materials reliability; Packaging; Printed circuits; Production; Surface-mount technology; System testing; Temperature distribution;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-930815-59-9
DOI :
10.1109/ISAPM.2000.869250
