DocumentCode
2420549
Title
Novel single pass reflow encapsulant for flip chip application
Author
Wang, Hui ; Tomaso, Torey
Author_Institution
Kester Solder, Litton Syst. Inc., Des Plaines, IL, USA
fYear
2000
fDate
2000
Firstpage
97
Lastpage
101
Abstract
A series of novel single pass reflow encapsulants with varied Tg´s below 125°C were investigated under multiple testing methods. The single pass reflow encapsulant with the lowest Tg (65°C) showed some of the best reliability, passing over 1000 cycles of LLTC (-55° to 125°C) testing. These results indicate that the Tg and CTE of the encapsulant are important but not critical parameters to the reliability of the flip chip package with single pass reflow encapsulants
Keywords
encapsulation; flip-chip devices; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; thermal expansion; -55 to 125 degC; CTE; LLTC testing; flip chip package; liquid-to-liquid thermal cycle; multiple testing methods; reliability; single pass reflow encapsulant; Assembly; Encapsulation; Flip chip; Materials reliability; Packaging; Printed circuits; Production; Surface-mount technology; System testing; Temperature distribution;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on
Conference_Location
Braselton, GA
Print_ISBN
0-930815-59-9
Type
conf
DOI
10.1109/ISAPM.2000.869250
Filename
869250
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