DocumentCode
2420768
Title
A 2.5-watt high frequency X-band power MMIC
Author
Avasarala, M. ; Day, D.S. ; Chan, S. ; Hua, C. ; Basset, J.R.
Author_Institution
Avantek Inc., Santa Clara, CA, USA
fYear
1989
fDate
12-13 June 1989
Firstpage
25
Lastpage
28
Abstract
The design and performance of a two-stage molecular-beam epitaxy (MBE) monolithic power amplifier chip is presented. The monolithic chip contains full interstage matching, partial matching at the input, and no match at the output. When matched to 50 Omega at input and output using off-chip circuitry, the MMIC demonstrates an overall performance of 34 dBm (0.436 W/mm) of power, 36% of power-added efficiency (PAE), and 14.5 dB of associated gain across the band 9.0-10.0 GHz. The PAE was as high as 38% in parts of the band. The average performance of 26 devices from at least 12 wafers from 5 different runs is 33.6 dBm (0.4 W/mm), 32%, and 14 dB, respectively. The chip size is 0.081 in*0.070 in*0.003 in (2.06 mm*1.78 mm/sup 2/).<>
Keywords
MMIC; field effect integrated circuits; impedance matching; microwave amplifiers; power amplifiers; power integrated circuits; 14.5 dB; 2.5 W; 36 percent; 70 to 81 mil; 9 to 10 GHz; MBE; SHF; X-band; gain; interstage matching; molecular-beam epitaxy; performance; power MMIC; power amplifier chip; power-added efficiency; Assembly; Circuits; Costs; FETs; Fingers; Frequency; Impedance matching; MMICs; Phased arrays; Size control;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave and Millimeter-Wave Monolithic Circuits Symposium, 1989. Digest of Papers., IEEE 1989
Conference_Location
Long Beach, CA, USA
Type
conf
DOI
10.1109/MCS.1989.37255
Filename
37255
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