• DocumentCode
    2420768
  • Title

    A 2.5-watt high frequency X-band power MMIC

  • Author

    Avasarala, M. ; Day, D.S. ; Chan, S. ; Hua, C. ; Basset, J.R.

  • Author_Institution
    Avantek Inc., Santa Clara, CA, USA
  • fYear
    1989
  • fDate
    12-13 June 1989
  • Firstpage
    25
  • Lastpage
    28
  • Abstract
    The design and performance of a two-stage molecular-beam epitaxy (MBE) monolithic power amplifier chip is presented. The monolithic chip contains full interstage matching, partial matching at the input, and no match at the output. When matched to 50 Omega at input and output using off-chip circuitry, the MMIC demonstrates an overall performance of 34 dBm (0.436 W/mm) of power, 36% of power-added efficiency (PAE), and 14.5 dB of associated gain across the band 9.0-10.0 GHz. The PAE was as high as 38% in parts of the band. The average performance of 26 devices from at least 12 wafers from 5 different runs is 33.6 dBm (0.4 W/mm), 32%, and 14 dB, respectively. The chip size is 0.081 in*0.070 in*0.003 in (2.06 mm*1.78 mm/sup 2/).<>
  • Keywords
    MMIC; field effect integrated circuits; impedance matching; microwave amplifiers; power amplifiers; power integrated circuits; 14.5 dB; 2.5 W; 36 percent; 70 to 81 mil; 9 to 10 GHz; MBE; SHF; X-band; gain; interstage matching; molecular-beam epitaxy; performance; power MMIC; power amplifier chip; power-added efficiency; Assembly; Circuits; Costs; FETs; Fingers; Frequency; Impedance matching; MMICs; Phased arrays; Size control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave and Millimeter-Wave Monolithic Circuits Symposium, 1989. Digest of Papers., IEEE 1989
  • Conference_Location
    Long Beach, CA, USA
  • Type

    conf

  • DOI
    10.1109/MCS.1989.37255
  • Filename
    37255