Flipchip on board (FCOB): solderability, reliability and the role of surface finish

Author

Li, Weiping ; Fields, Harold ; Parker, Richard

Author_Institution

Delphi-Delco Electron. Syst., Kokomo, IN, USA

fYear

2000

fDate

2000

Firstpage

172

Lastpage

174

Abstract

Five surface finishes were evaluated for their effects on the solderability and reliability of FCOB assembly. Several test vehicles were employed in this evaluation for different purposes. Test vehicle boards were pre-conditioned and processed to simulate the storage and actual production environment. The surface finishes were found to have profound impact on the solderability and reliability of flip chip on board. The interactions between surface finish, flip chip bump metallurgy and configuration, underfill material, flux and pad geometry must be taken into consideration and optimized to achieve both solderability and reliability

Keywords

chip-on-board packaging; flip-chip devices; integrated circuit reliability; reflow soldering; surface treatment; FCOB assembly; bump configuration; flip chip bump metallurgy; flux geometry; pad geometry; reliability; solderability; surface finishes effect; underfill material; Assembly; Automotive electronics; Costs; Flip chip; Packaging; Soldering; Surface finishing; Temperature; Testing; Vehicles;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on

Conference_Location

Braselton, GA

Print_ISBN

0-930815-59-9

Type

conf

DOI

10.1109/ISAPM.2000.869264

Filename

869264