A Micromachined Platform for Three Dimensional Dielectrophoretic Assembly of Gold Nanoparticles for Nanodevices

This paper reports a novel technological approach for three-dimensional (3D) assembly of gold nanoparticles with an average diameter of 52 nm using dielectrophoresis (DEP). To realize the 3D assembly, the authors have designed and fabricated a versatile self-aligned micromachined platform which is applicable for assembling metallic nanoparticles and nanostructures. The assembly process is achieved at room temperature and is compatible with conventional semiconductor fabrication and large scale nanoassembly. The current-voltage curves obtained from the 3D gold nanoparticle bridges demonstrate that the assembly is functional with resistance values between -26 and 118 Ohms. This method has applications in making high density three-dimensional interconnects, vertically integrated nano sensors and for in-line testing of manufactured conductive nanoelements.