Comparison of various micro via technology

Author

Nishiwaki, Toshio ; Mikado, Yukinobu ; Kuroiwa, Nobuhiro

Author_Institution

IBIDEN Co. Ltd., Gifu, Japan

fYear

2000

fDate

2000

Firstpage

233

Lastpage

237

Abstract

IC packaging continues to grow in complexity. The trend to smaller packaging with higher pin counts requires PWB (printed wiring board) technology to keep pace. The current answer to this continuing trend of component micro sizing is the emerging Microvia Technology. At IBIDEN we have dedicated our resources to the study of the technology and process capability of Microvia PWBs. We have achieved this goal by analyzing photo and laser via forming, subtractive and additive patterning and various combinations of base materials that exhibit specific physical characteristics

Keywords

integrated circuit packaging; microassembling; plastic packaging; printed circuit design; printed circuit manufacture; IC packaging; additive patterning; base materials; build-up PWBs; component micro sizing; laser via forming; micro via technology; microvia PWBs; photo via forming; physical characteristics; pin counts; printed wiring board technology; subtractive patterning; Additives; Chip scale packaging; Costs; Dielectric materials; Electronics packaging; Flip chip; Mass production; Optical materials; Packaging machines; Resins;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on

Conference_Location

Braselton, GA

Print_ISBN

0-930815-59-9

Type

conf

DOI

10.1109/ISAPM.2000.869277

Filename

869277