• DocumentCode
    2421061
  • Title

    A monolithic 60 GHz diode mixer in FET compatible technology

  • Author

    Adelseck, B. ; Colquhoun, A. ; Dieudonne, J.M. ; Ebert, G. ; Selders, J. ; Schmegner, K.E. ; Schwab, W.

  • Author_Institution
    AEG Aktiengesellschaft, Ulm, West Germany
  • fYear
    1989
  • fDate
    12-13 June 1989
  • Firstpage
    91
  • Lastpage
    94
  • Abstract
    A method of simultaneously fabricating MESFETs with a maximum frequency of oscillation (f/sub max/) of 70 GHz and Schottky diodes with a gain-bandwidth product (f/sub T/) of approximately=2300 GHz to produce a 60-GHz mixer is given. A deep selective n/sup +/ implantation for a buried n/sup +/ zone under the mixer diode was used. Metalorganic chemical vapor deposition (MOCVD) was used for the growth of the active n layer and an n/sup +/ surface contact layer. The MESFETs and the diodes were both fabricated with a recessed Schottky contact structure using Ti-Pt-Au metallization. Arrays of 30 different diodes and 55 different MESFETs were fabricated to study the process technology and to get optimum devices for a receiver chip containing a diode balanced mixer plus a low-noise intermediate-frequency (IF) amplifier. The conversion loss and noise figures of the diodes were measured and compared with those obtained from computer simulations. Both large- and small-signal analysis are included. The 60-GHz balanced mixer chip shows a conversion loss of 6.0 dB and a double-sideband noise figure of 3.3 dB.<>
  • Keywords
    MMIC; Schottky-barrier diodes; chemical vapour deposition; field effect integrated circuits; integrated circuit technology; ion implantation; metallisation; microwave amplifiers; mixers (circuits); 3.3 dB; 6 dB; 60 GHz; EHF; FET compatible technology; IF amplifiers; MESFETs; MOCVD; Schottky diodes; Ti-Pt-Au metallization; balanced mixer chip; conversion loss; diode balanced mixer; diode mixer; double-sideband noise figure; frequency of oscillation; gain-bandwidth product; low noise amplifiers; noise figures; process technology; receiver chip; recessed Schottky contact structure; small-signal analysis; Chemical vapor deposition; FETs; Frequency; Low-noise amplifiers; MESFETs; MOCVD; Metallization; Noise figure; Schottky barriers; Schottky diodes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave and Millimeter-Wave Monolithic Circuits Symposium, 1989. Digest of Papers., IEEE 1989
  • Conference_Location
    Long Beach, CA, USA
  • Type

    conf

  • DOI
    10.1109/MCS.1989.37270
  • Filename
    37270