DocumentCode :
242117
Title :
The role of dianglin bonds in resistance switching behaviors of SiOx - Based RRAM
Author :
Kunji Chen ; Yuefei Wang ; Zhonghui Fang ; Wei Li ; Jun Xu ; Xinfan Huang
Author_Institution :
State Key Lab. of Solid State Microstructures, Nanjing Univ., Nanjing, China
fYear :
2014
fDate :
28-31 Oct. 2014
Firstpage :
1
Lastpage :
4
Abstract :
We investigated The silicon dianglin bonds (DBs) features and resistance switching behavior of silicon suboxides (SiOx) sandwiched between Pt electrodes to study the x dependent operation characteristics and the nature of intrinsic conducting filaments in SiOx based resistance random access memories (ReRAM). When x<;0.80, the forming/set operations need a current compliance and the reset voltage Vreset is lower than set voltage Vset. However, when x>0.95, the operations don´t need a current compliance and Vreset is higher than Vset. X-ray photoelectron spectroscopy (XPS) and electron spin resonance (ESR) measurements are employed to discover the transition of relative concentration of Si-O tetrahedral configurations and Si DBs with different x value. We propose a Si-DBs percolation model to explain the above characteristics.
Keywords :
X-ray photoelectron spectra; forming processes; paramagnetic resonance; platinum; resistive RAM; silicon compounds; ESR measurements; Pt; Pt electrodes; Si-DB percolation model; Si-O tetrahedral configurations; SiOx; SiOx based RRAM; SiOx based ReRAM; SiOx based resistance random access memories; X-ray photoelectron spectroscopy measurements; XPS measurements; current compliance; dependent operation characteristics; electron spin resonance measurements; forming-set operations; intrinsic conducting filaments; reset voltage; resistance switching behavior; silicon dianglin bonds features; silicon suboxides; Abstracts; Atomic measurements; Chemicals; Current measurement; Laboratories; Silicon; Switches;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated Circuit Technology (ICSICT), 2014 12th IEEE International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4799-3296-2
Type :
conf
DOI :
10.1109/ICSICT.2014.7021485
Filename :
7021485
Link To Document :
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