DocumentCode
2421210
Title
Investigating molecular interactions between underfill resins and organic passivator layers via flow microcalorimetry
Author
Pearson, R.A. ; Welsh, D.J. ; Lloyd, T.B.
Author_Institution
Microelectron. Packaging Mater. lab., Lehigh Univ., Bethlehem, PA, USA
fYear
2000
fDate
2000
Firstpage
285
Lastpage
288
Abstract
Contact angle measurements and flow microcalorimetry are two methods being investigated at Lehigh University, for their use in probing surfaces to look at acid-base interactions and strength of molecular interactions at interfaces. The practical adhesion between two phases depends on both the mechanical and energetic interfacial interactions of the phases. The energetic interaction may be divided into the dispersion and the acid-base interactions. In this paper the techniques are applied to interfaces between underfill resins and organic passivator layers
Keywords
adhesion; calorimetry; contact angle; encapsulation; organic compounds; passivation; polymer films; acid-base interaction; adhesion; contact angle measurement; dispersion interaction; flow microcalorimetry; interfacial interaction; molecular interaction; organic passivator layer; underfill resin; Data analysis; Equations; Fluid flow measurement; Goniometers; Liquids; Polymers; Powders; Probes; Resins; Solvents;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on
Conference_Location
Braselton, GA
Print_ISBN
0-930815-59-9
Type
conf
DOI
10.1109/ISAPM.2000.869286
Filename
869286
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