• DocumentCode
    2421210
  • Title

    Investigating molecular interactions between underfill resins and organic passivator layers via flow microcalorimetry

  • Author

    Pearson, R.A. ; Welsh, D.J. ; Lloyd, T.B.

  • Author_Institution
    Microelectron. Packaging Mater. lab., Lehigh Univ., Bethlehem, PA, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    285
  • Lastpage
    288
  • Abstract
    Contact angle measurements and flow microcalorimetry are two methods being investigated at Lehigh University, for their use in probing surfaces to look at acid-base interactions and strength of molecular interactions at interfaces. The practical adhesion between two phases depends on both the mechanical and energetic interfacial interactions of the phases. The energetic interaction may be divided into the dispersion and the acid-base interactions. In this paper the techniques are applied to interfaces between underfill resins and organic passivator layers
  • Keywords
    adhesion; calorimetry; contact angle; encapsulation; organic compounds; passivation; polymer films; acid-base interaction; adhesion; contact angle measurement; dispersion interaction; flow microcalorimetry; interfacial interaction; molecular interaction; organic passivator layer; underfill resin; Data analysis; Equations; Fluid flow measurement; Goniometers; Liquids; Polymers; Powders; Probes; Resins; Solvents;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on
  • Conference_Location
    Braselton, GA
  • Print_ISBN
    0-930815-59-9
  • Type

    conf

  • DOI
    10.1109/ISAPM.2000.869286
  • Filename
    869286