DocumentCode
2421273
Title
Characterization of underfill/passivation interfaces using fracture mechanics
Author
Pearson, R.A. ; McAdams, B.J.
Author_Institution
Microelectron. Packaging Mater. Lab., Lehigh Univ., Bethlehem, PA, USA
fYear
2000
fDate
2000
Firstpage
300
Lastpage
302
Abstract
The purpose of work is to assess adhesion between underfill resins and organic passivation layers using fracture mechanics. We are particularly interested in examining the utility of two types of double cantilever beam specimens: a short, thick double cantilever beam (DCB) specimen versus a long, slender asymmetric double cantilever beam specimen (ADCB)
Keywords
adhesion; encapsulation; fracture mechanics; passivation; adhesion; asymmetric double cantilever beam; double cantilever beam; fracture mechanics; organic passivation layer; underfill resin; underfill/passivation interface; Adhesives; Bonding; Flip chip; Microelectronics; Packaging; Passivation; Polyimides; Resins; Structural beams; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on
Conference_Location
Braselton, GA
Print_ISBN
0-930815-59-9
Type
conf
DOI
10.1109/ISAPM.2000.869289
Filename
869289
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