Title :
Characterization of underfill/passivation interfaces using fracture mechanics
Author :
Pearson, R.A. ; McAdams, B.J.
Author_Institution :
Microelectron. Packaging Mater. Lab., Lehigh Univ., Bethlehem, PA, USA
Abstract :
The purpose of work is to assess adhesion between underfill resins and organic passivation layers using fracture mechanics. We are particularly interested in examining the utility of two types of double cantilever beam specimens: a short, thick double cantilever beam (DCB) specimen versus a long, slender asymmetric double cantilever beam specimen (ADCB)
Keywords :
adhesion; encapsulation; fracture mechanics; passivation; adhesion; asymmetric double cantilever beam; double cantilever beam; fracture mechanics; organic passivation layer; underfill resin; underfill/passivation interface; Adhesives; Bonding; Flip chip; Microelectronics; Packaging; Passivation; Polyimides; Resins; Structural beams; Testing;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-930815-59-9
DOI :
10.1109/ISAPM.2000.869289
