DocumentCode
2421326
Title
Miniature hybrid microwave ICs using a novel thin-film technology
Author
Eda, K. ; Miwa, T. ; Taguchi, Y. ; Uwano, T.
Author_Institution
Matsushita Electric Ind. Co. Ltd., Osaka, Japan
fYear
1990
fDate
8-10 May 1990
Firstpage
419
Abstract
A novel thin-film technology for miniature hybrid microwave ICs is presented. All passive components are fully integrated on ordinary alumina ceramic substrates using the thin-film technology with very high yield. The number of parts and wiring processes were significantly reduced. The application of this technology to the fabrication of Ku-band solid-state power amplifiers is described.<>
Keywords
hybrid integrated circuits; microwave amplifiers; microwave integrated circuits; power amplifiers; thin film circuits; Ku-band; MIC; SHF; alumina ceramic substrates; high yield; miniature hybrid microwave ICs; solid-state power amplifiers; thin-film technology; wiring processes; Capacitors; Ceramics; FETs; Gallium arsenide; Microwave technology; Power amplifiers; Resistors; Substrates; Thin film circuits; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1990., IEEE MTT-S International
Conference_Location
Dallas, TX
Type
conf
DOI
10.1109/MWSYM.1990.99609
Filename
99609
Link To Document