DocumentCode :
2421326
Title :
Miniature hybrid microwave ICs using a novel thin-film technology
Author :
Eda, K. ; Miwa, T. ; Taguchi, Y. ; Uwano, T.
Author_Institution :
Matsushita Electric Ind. Co. Ltd., Osaka, Japan
fYear :
1990
fDate :
8-10 May 1990
Firstpage :
419
Abstract :
A novel thin-film technology for miniature hybrid microwave ICs is presented. All passive components are fully integrated on ordinary alumina ceramic substrates using the thin-film technology with very high yield. The number of parts and wiring processes were significantly reduced. The application of this technology to the fabrication of Ku-band solid-state power amplifiers is described.<>
Keywords :
hybrid integrated circuits; microwave amplifiers; microwave integrated circuits; power amplifiers; thin film circuits; Ku-band; MIC; SHF; alumina ceramic substrates; high yield; miniature hybrid microwave ICs; solid-state power amplifiers; thin-film technology; wiring processes; Capacitors; Ceramics; FETs; Gallium arsenide; Microwave technology; Power amplifiers; Resistors; Substrates; Thin film circuits; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium Digest, 1990., IEEE MTT-S International
Conference_Location :
Dallas, TX
Type :
conf
DOI :
10.1109/MWSYM.1990.99609
Filename :
99609
Link To Document :
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