Title :
Low stress moderate temperature reworkable adhesives for advanced MCM-D technology
Author :
Wu, Jiali ; Wong, C.P.
Author_Institution :
Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
A novel low stress moderate temperature reworkable (LSMTR) adhesive is reported in this paper. An elastomeric silicone was selected as base resin system to guarantee the low stress requirement for large scale MCM-D batch production. The reworkability of the adhesive was realized using a special catalyst, which was thermally stable at working temperature (200°C) and decomposed completely after being held at reworkable temperature (250°C) for 1h. Thermal and mechanical properties of the adhesive were characterized by Differential Scanning Calorimeter (DSC), Thermogravimetric Analyzer (TGA) and Dynamic Mechanical Analyzer (DMA), and the prototype test was conducted using silicone wafer and KaptonR film as tiles and substrates, respectively. From this study, an effective method was explored for the development of new reworkable adhesives to meet various temperature requirements
Keywords :
adhesives; catalysts; elastomers; multichip modules; silicones; thermal analysis; 200 to 250 C; Kapton film substrate; MCM-D technology; batch production; catalyst; differential scanning calorimetry; dynamic mechanical analysis; elastomeric silicone resin; low stress moderate temperature reworkable adhesive; mechanical properties; silicone wafer tile; thermal properties; thermogravimetric analysis; Batch production systems; Conductive films; Large-scale systems; Mechanical factors; Prototypes; Resins; Temperature; Testing; Thermal conductivity; Thermal stresses;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties andInterfaces, 2000. Proceedings. International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-930815-59-9
DOI :
10.1109/ISAPM.2000.869294
