A new reliability prediction tool

The structure of a new reliability methodology for electronic systems is presented. Reliability prediction tool has two aspects. First it is used in a priori fashion to scale an initial reliability prediction based upon which development process initiatives are used. Secondly, the model does a “data fusion” or integration of all reliability data derived over the duration of the development process. One feature is that the new model introduces a variance measure into the MTBF prediction. The CAE presentation focuses on the a priori part of the model since that is deemed to operationalize a concurrent engineering focus in a timely manner for new product development