DocumentCode
2421893
Title
Surface degradation properties of the polymer composite
Author
Park, J.K. ; Kim, B.S. ; Lee, D.C.
Author_Institution
Yuhan Coll., Puchon, South Korea
fYear
2003
fDate
19-22 Oct. 2003
Firstpage
68
Lastpage
71
Abstract
In this study, heat and discharge treatments are arbitrary simulated for finding out the initiations and processes of surface degradation on the surface of polymer for using PCB substrate. Thermal-treatment changed the surface to the hydrophobic one with the increase of contact angle and surface potential decay respectively. In XPS spectrum to analyze surface chemical structures, the increased hydrophobicity in thermal treatment was originated from the continuous decrease of side-chains caused by oxygen groups and the increase of unsaturated double bond in carbon chains. In the chemical change of discharge treatment, a lot of side-chains comprising carboxyl radical occurred on the treated surface and the hydrophilicity increased as time elapsed.
Keywords
X-ray photoelectron spectra; composite materials; contact angle; glass fibre reinforced plastics; heat treatment; organic insulating materials; plasma materials processing; polymers; surface potential; surface treatment; XPS; contact angle; discharge treatments; heat treatments; hydrophobic; polymer composite; side-chains; surface chemical structures; surface degradation properties; surface potential decay; thermal treatment; unsaturated double bond; Chemicals; Composite materials; Dielectrics and electrical insulation; Heat treatment; Mechanical factors; Plastic insulation; Polymers; Surface discharges; Surface treatment; Thermal degradation;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena, 2003. Annual Report. Conference on
Print_ISBN
0-7803-7910-1
Type
conf
DOI
10.1109/CEIDP.2003.1254796
Filename
1254796
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