DocumentCode
2422132
Title
Focused ion beam lithography and implantation
Author
Melngailis, John
Author_Institution
Res. Lab. of Electron., MIT, Cambridge, MA, USA
fYear
1989
fDate
12-14 Jun 1989
Firstpage
70
Lastpage
75
Abstract
The author surveys ion beam lithography and maskless, resistless implantation. These applications generally demand the most sophisticated machinery including high voltage and mass separation, and so far they have been demonstrated only in the research laboratory. However, their long-range impact may be significant. In lithography, the absence of proximity effect and the ability to expose resist with fine features and vertical sidewalls without multilevel techniques offer distinct advantages. Focused ion beam implantation may, in special cases, be substituted for conventional fabrication, for example in CMOS threshold adjust and in special GaAs devices. The key issue of writing time is examined
Keywords
integrated circuit technology; ion beam lithography; ion implantation; semiconductor technology; CMOS threshold adjust; GaAs devices; focused ion beam lithography; maskless resistless implantation; research laboratory; resist exposure; vertical sidewalls; writing time; Application software; Current density; Gallium arsenide; Ion beams; Laboratories; Lithography; Particle beams; Resists; Solids; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
University/Government/Industry Microelectronics Symposium, 1989. Proceedings., Eighth
Conference_Location
Westborough, MA
ISSN
0749-6877
Type
conf
DOI
10.1109/UGIM.1989.37304
Filename
37304
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