• DocumentCode
    2422132
  • Title

    Focused ion beam lithography and implantation

  • Author

    Melngailis, John

  • Author_Institution
    Res. Lab. of Electron., MIT, Cambridge, MA, USA
  • fYear
    1989
  • fDate
    12-14 Jun 1989
  • Firstpage
    70
  • Lastpage
    75
  • Abstract
    The author surveys ion beam lithography and maskless, resistless implantation. These applications generally demand the most sophisticated machinery including high voltage and mass separation, and so far they have been demonstrated only in the research laboratory. However, their long-range impact may be significant. In lithography, the absence of proximity effect and the ability to expose resist with fine features and vertical sidewalls without multilevel techniques offer distinct advantages. Focused ion beam implantation may, in special cases, be substituted for conventional fabrication, for example in CMOS threshold adjust and in special GaAs devices. The key issue of writing time is examined
  • Keywords
    integrated circuit technology; ion beam lithography; ion implantation; semiconductor technology; CMOS threshold adjust; GaAs devices; focused ion beam lithography; maskless resistless implantation; research laboratory; resist exposure; vertical sidewalls; writing time; Application software; Current density; Gallium arsenide; Ion beams; Laboratories; Lithography; Particle beams; Resists; Solids; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    University/Government/Industry Microelectronics Symposium, 1989. Proceedings., Eighth
  • Conference_Location
    Westborough, MA
  • ISSN
    0749-6877
  • Type

    conf

  • DOI
    10.1109/UGIM.1989.37304
  • Filename
    37304