Title :
A Dynamic Customizable Model for Component-Based Embedded Systems
Author :
Lu, Huijuan ; Tang, Wenbin ; Wang, Xunbin
Author_Institution :
Dept. of Comput. Sci. & Technol., China Jiliang Univ., Hangzhou
Abstract :
Recent years have witnessed the rapid growth in the field of embedded systems (ES). Due to the diversity of client-specific requirements from embedded or mobile applications, flexible design or/and dynamic customization for embedded systems are receiving more and more attention from researchers and developers. To ease the process of implementation and deployment of embedded systems, plenty of component-based frameworks and models are proposed, which settle the existing issues to some extent and boost the development of embedded systems. However, many problems, e.g. lowness in tailoring ability of components and poorness in code reusability are mainly left unsolved. To rectify the subsistent problems, this paper presents a new smart and dynamic customization embedded component based model (SDCECM). SDCECM that allows the developers to dynamically customize SDCECM standard compliant components without exiting host system optimizes the component construction architecture, component services and component assembling and deployment to satisfy the requirement of the development embedded systems.
Keywords :
embedded systems; formal specification; mobile computing; object-oriented programming; software architecture; software reusability; client-specific requirements; code reusability; component assembling; component construction architecture; component deployment; component services; component-based embedded systems; dynamic customizable model; embedded applications; flexible design; mobile applications; Application software; Assembly systems; Computer architecture; Computer science; Connectors; Embedded software; Embedded system; Libraries; Standards development; XML;
Conference_Titel :
Audio, Language and Image Processing, 2008. ICALIP 2008. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1723-0
Electronic_ISBN :
978-1-4244-1724-7
DOI :
10.1109/ICALIP.2008.4590018