• DocumentCode
    2423151
  • Title

    Computation of electro-thermal breakdown of polymer films

  • Author

    Qi, Xiaoguang ; Zheng, Zhoug ; Boggs, Steven

  • Author_Institution
    Electr. Insulation Res. Center, Univ. of Connecticut, CT, USA
  • fYear
    2003
  • fDate
    19-22 Oct. 2003
  • Firstpage
    337
  • Lastpage
    340
  • Abstract
    Development of new polymer films is impeded by the need to make large quantities of high quality film for prototype devices. However, DC breakdown should be predictable from material electrothermal properties, i.e., field and temperature dependent electrical conductivity, thermal diffusivity, and boundary conditions. Transient nonlinear finite element analysis readily predicts thermal runaway of a polymer film between metal electrodes. In this contribution, we evaluate analytical approaches to this problem in the context of laboratory testing between metal electrodes. The objective is to predict approximate limits to device performance as a function of electric field and temperature from measurements on prototype materials.
  • Keywords
    electric breakdown; finite element analysis; polymer films; thermal diffusivity; DC breakdown; approximate limits; boundary conditions; device performance; electrothermal breakdown; field dependent electrical conductivity; heat balance equation; large positive thermal feedback; metal electrodes; polymer films; quasi-steady state approximation; temperature dependent electrical conductivity; thermal diffusivity; thermal runaway; transient nonlinear finite element analysis; Conducting materials; Electric breakdown; Electrodes; Electrothermal effects; Impedance; Polymer films; Prototypes; Temperature dependence; Temperature measurement; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 2003. Annual Report. Conference on
  • Print_ISBN
    0-7803-7910-1
  • Type

    conf

  • DOI
    10.1109/CEIDP.2003.1254862
  • Filename
    1254862