DocumentCode
2423168
Title
Insulation technology for medium voltage solid insulated switchgear
Author
Shioiri, T. ; Sato, J. ; Ozaki, T. ; Sakaguchi, O. ; Kamikawaji, T. ; Miyagawa, M. ; Homma, M. ; Suzuki, K.
Author_Institution
Toshiba Corp., Tokyo, Japan
fYear
2003
fDate
19-22 Oct. 2003
Firstpage
341
Lastpage
344
Abstract
The authors have developed solid insulated switchgear that does not use SF6 gas at all as an insulating medium. This paper describes the insulating material technology, diagnostic technology for partial discharge, insulation technology of the vacuum disconnecting switch and aerial composite insulation technology which are applied to this solid insulated switchgear. A new epoxy resin, which was dispersedly configured with spherical silica and rubber particles, was developed. The insulation performance of this resin is 50% higher compared with filling of alumina. Utilizing the features of the solid insulated switchgear, a diagnostic technology for partial discharge employing an acoustic emission (AE) sensor was developed. A vacuum disconnecting switch with high insulation reliability was developed applying Weibull distribution to dielectric breakdown in a vacuum. The insulated parts of insulating rods of circuit-breakers and disconnecting switches were miniaturized through composite insulation.
Keywords
Weibull distribution; composite insulating materials; electric breakdown; epoxy insulation; filled polymers; insulation testing; partial discharge measurement; switchgear insulation; vacuum circuit breakers; Weibull distribution; acoustic emission sensor; aerial composite insulation technology; circuit-breakers; dielectric breakdown in vacuum; epoxy resin; insulating material technology; insulating rods; medium voltage switchgear; partial discharge; solid insulated switchgear; vacuum disconnecting switch; vacuum insulation; Dielectrics and electrical insulation; Gas insulation; Materials science and technology; Medium voltage; Partial discharges; Solids; Switches; Switchgear; Vacuum breakdown; Vacuum technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena, 2003. Annual Report. Conference on
Print_ISBN
0-7803-7910-1
Type
conf
DOI
10.1109/CEIDP.2003.1254863
Filename
1254863
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