DocumentCode :
2423254
Title :
Investigation of breakdown of an EPSB polymeric arrester based on the life estimation using a multiple regression model
Author :
Mohammed, A. ; Sundararajan, R.
Author_Institution :
Electron. & Comput. Eng. Technol. Dept., Arizona State Univ. East, Mesa, AZ, USA
fYear :
2003
fDate :
19-22 Oct. 2003
Firstpage :
365
Lastpage :
368
Abstract :
This paper presents a novel approach to estimate the life expectancy of polymeric arresters aged under accelerated multistress conditions simulating Florida environment. This is based on a multiple regression model that uses the FTIR peak height variations of the filler material of the polymeric arrester over the 15 year aging period. The method for the estimation of life is to find out the type of distribution that the peak heights of the filler material follows and determine valid parameters for that distribution. Using this a probability function is obtained to estimate the time for failure. In the present case, a Weibull distribution was obtained from the probability plot and a half-life of 19.5 years was estimated. This is in line with the expected life of polymeric materials used for high voltage outdoor insulation verifying the validity of the model.
Keywords :
Fourier transform spectra; Weibull distribution; arresters; filled polymers; infrared spectra; polyethylene insulation; regression analysis; silicon; EPSB polymeric arrester; FTIR peak height variations; Florida environment; Weibull distribution; accelerated multistress conditions; breakdown; ethylene propylene silicon blend; filler material; half-life; high voltage outdoor insulation; life estimation; multiple regression model; probability plot; Accelerated aging; Arresters; Bonding; Electric breakdown; Infrared spectra; Laboratories; Life estimation; Plastic insulation; Polymers; Weibull distribution;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena, 2003. Annual Report. Conference on
Print_ISBN :
0-7803-7910-1
Type :
conf
DOI :
10.1109/CEIDP.2003.1254869
Filename :
1254869
Link To Document :
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