• DocumentCode
    2424089
  • Title

    A 1.0 V 78 μW reconfigurable ASIC embedded in an intelligent electrode for continuous remote ECG applications

  • Author

    Yang, Geng ; Chen, Jian ; Jonsson, Fredrik ; Tenhunen, Hannu ; Zheng, Li-Rong

  • Author_Institution
    Sch. of Inf. & Commun. Technol., KTH-R. Inst. of Technol., Kista-Stockholm, Sweden
  • fYear
    2009
  • fDate
    3-6 Sept. 2009
  • Firstpage
    2316
  • Lastpage
    2319
  • Abstract
    In this paper, a reconfigurable, low-power Application Specific Integrated Circuit (ASIC) that extracts and transmits electrocardiograph (ECG) signals is presented. An intelligent electrode is introduced which consists of the proposed ASIC and a micro spike array, permitting onsite ECG signal acquisition, processing and transmission. Fabricated in a standard 0.18 mum CMOS process, the ASIC consumes 78 muW with 1.0 V core voltage at 6 MHz operating frequency and only occupies 2.25 mm2. The tiny silicon size makes it possible and suitable to embed the proposed ASIC into an intelligent electrode, and the low power consumption makes it feasible for long term continuous ECG monitoring.
  • Keywords
    CMOS integrated circuits; application specific integrated circuits; biomedical electrodes; biomedical electronics; electrocardiography; health care; medical signal processing; patient monitoring; reconfigurable architectures; silicon; CMOS process; continuous remote ECG monitoring; electrocardiograph signal; frequency 6 MHz; health care; intelligent electrode; low-power application specific integrated circuit; micro spike array; power 78 muW; reconfigurable ASIC; signal acquisition; signal processing; signal transmission; size 0.18 mum; voltage 1.0 V; Biomedical Engineering; Computers; Electricity; Electrocardiography; Electrodes; Electronics, Medical; Equipment Design; Heart Rate; Humans; Signal Processing, Computer-Assisted; Silicon; Telemetry;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2009. EMBC 2009. Annual International Conference of the IEEE
  • Conference_Location
    Minneapolis, MN
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-3296-7
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/IEMBS.2009.5335120
  • Filename
    5335120